Skip to content
中文
Home
Products
Power Module
IGBT Module
Automotive Module
Industrial Module
PV&PCS Module
SiC Module
Rectifier Module
MOS Module
Discrete Devices
IGBT Discrete
SiC Discrete
Superjunction MOS Discrete
SGT MOS Discrete
MOSFET Discrete
Automotive
Industrial
Wafer
IGBT
SIC MOS
SJ MOS
SGT MOS
FRD
Infrared Sensors
PIR
Toolchain
Compiler
Debugger
Static and Dynamic Testing Tools
Model Testing Tools
Neusoft Reach
CAN Communication
Code Package
Others
Application Fields
Industrial Control
Inverters / Servo Drives
Industry Requirements
Application Solutions
Product Selection Guide
UPS Power Supplies
Industry Requirements
Application Solutions
Product Selection Guide
Welding & Induction Heating
Industry Requirements
Application Solutions
Product Selection Guide
Automotive Electronics
EV Main Drive Inverter
Industry Requirements
Application Solutions
Product Selection Guide
OBC
Industry Requirements
Application Solutions
Product Selection Guide
Automotive Power Supply
Industry Requirements
Application Solutions
Product Selection Guide
EV Charger
Industry Requirements
Application Solutions
Product Selection Guide
Energy
Power Conversion System
Industry Requirements
Application Solutions
Product Selection Guide
Service Support
Technical Articles
Product Application Manual
Simulation support
Sample Request
About Us
About Us
Company Profile
QUALIFICATION CERTIFICATE
Honor
INTELLIGENT PRODUCTION
LABORATORY
Quality Policy
News
Company News
Industry News
Join Us
Corporate Culture
Job Recruitment
Toggle website search
Menu
Close
Home
Products
Power Module
IGBT Module
Automotive Module
Industrial Module
PV&PCS Module
SiC Module
Rectifier Module
MOS Module
Discrete Devices
IGBT Discrete
SiC Discrete
Superjunction MOS Discrete
SGT MOS Discrete
MOSFET Discrete
Automotive
Industrial
Wafer
IGBT
SIC MOS
SJ MOS
SGT MOS
FRD
Infrared Sensors
PIR
Toolchain
Compiler
Debugger
Static and Dynamic Testing Tools
Model Testing Tools
Neusoft Reach
CAN Communication
Code Package
Others
Application Fields
Industrial Control
Inverters / Servo Drives
Industry Requirements
Application Solutions
Product Selection Guide
UPS Power Supplies
Industry Requirements
Application Solutions
Product Selection Guide
Welding & Induction Heating
Industry Requirements
Application Solutions
Product Selection Guide
Automotive Electronics
EV Main Drive Inverter
Industry Requirements
Application Solutions
Product Selection Guide
OBC
Industry Requirements
Application Solutions
Product Selection Guide
Automotive Power Supply
Industry Requirements
Application Solutions
Product Selection Guide
EV Charger
Industry Requirements
Application Solutions
Product Selection Guide
Energy
Power Conversion System
Industry Requirements
Application Solutions
Product Selection Guide
Service Support
Technical Articles
Product Application Manual
Simulation support
Sample Request
About Us
About Us
Company Profile
QUALIFICATION CERTIFICATE
Honor
INTELLIGENT PRODUCTION
LABORATORY
Quality Policy
News
Company News
Industry News
Join Us
Corporate Culture
Job Recruitment
Toggle website search
Company News
Industry News
Technical Articles
Company News
Industry News
Technical Articles
您当前的位置:
Your Location:
Home
»
IGBT芯片工艺流程[2024.06.29]
IGBT芯片工艺流程[2024.06.29]
2025-01-10
14:05
IGBT,全称绝缘栅双极性晶体管(Insulated Gate Bipolar Transistor),是由MOS(绝缘栅型场效应管)和BJT(双极性晶体管)组成的复合全控型功率半导体器件,俗称电力电子装置的“CPU”,通过十几伏的门极控制信号,即可实现kV级电压和kA级电流的控制,作为国家战略性新兴产业,在轨道交通、智能电网、工业节能、电动汽车与新能源装备等领域应用极为广泛。
好了,IGBT芯片的整个加工流程介绍完了,步骤里面只提到了Emitter和Collecter电极,那么大家想一想Gate电极又是在哪部形成的呢? 朋友们,发挥您的思维和智慧吧!
Prev
上一篇
跨越国界,拥抱未来[2024.06.21]
下一篇
翠展微科技新篇章,点亮慕尼黑电子展[2024.07.08]
Next
相关新闻
GCP40GX120PIB1
翠展微电子恭祝大家:新春快乐,蛇年大吉!
喜报|翠展微电子荣获“浙江省专精特新中小企业”称号
翠展微电子完成数亿元B+轮融资,加速IGBT&SiC模块产能扩张与市场布局
翠展微科技新篇章,点亮慕尼黑电子展[2024.07.08]
跨越国界,拥抱未来[2024.06.21]
携一体化高性能逆变砖技术亮相2024全 球车规级功率半导体峰会[2024.05.31]
北京国际汽车展览会2024盛大启幕,与翠展微一起共赴汽车盛宴![2024.04.26]
翠展微新能源汽车功率模块的关键技术突破与可靠性验证[2024.04.12]
翠展微电子:把握市场发展脉搏,坚守“中国芯”[2024.03.05]
产学研交流—哈工大田艳红教授一行到访翠展微[2023.12.26]
翠展微电子入选2023年嘉兴市国家高新技术企业电子信息高成长十强榜单[2024.03.01]